Support in fine-tuning your wire bonding process

Manage the challenges of tight development cycles and the shortage of skilled employees. Acquire external resources to optimize your wire bonding process and solve existing manufacturing problems even faster. Process optimization and simultaneous training of your skilled employees go hand in hand.

Set up wire bonding processes even more reliably and improve wire bond quality.

Benefit from expert knowledge and qualified specialists

Setting process parameters, checking & documenting your process quality

You gain access to over 20 years of experience with a wide range of wire bonding equipment in numerous combinations of surface finishes and wire materials. Directly in your process at your site or on fully automated equipment at our facilities.

We also have access to analytical equipment for optical inspection using a light microscope and SEM. For more complex analyses, such as the determination of contaminants and oxides on surfaces, we draw on the expertise of specialised analytical partners with whom we have a proven track record to ensure you receive reliable analytical results.

Technology expertise when needed

Wide range of wire bonding know-how and practice

Wedge/Wedge wire bonding of 17 to 75 µm aluminum and gold wires at various bonding frequency (F&K Delvotec, Hesse Mechatronics, F&S Bondtec)
Ball/Wedge gold and copper wire bonding of 17 to 50 µm wires (F&K Delvotec, Hesse Mechatronics, F&S Bondtec, ASM, Palomar, K&S)
Thick wire bonding of Al and AlCu wires (F&K Delvotec, Hesse Mechatronics, K&S)
Pull and shear testing of thin and thick wires as well as components and test structures
Interface analysis on thick-wire bonding contacts using BAMFIT testing
Looping studies, bonding parameter DoE, high speed video analysis, transducer and bonding tool characterization

Typical situations in which our customers request support

Bond parameter optimization

Bond parameters urgently need to be re-optimized in order to achieve the customer specifications for pull and shear tests.

Loop geometry adjustment

Loop geometries must be adapted to pass the qualification tests for an existing or a new product.

Reoptimization after material change

A material change is necessary because a change is required for functional reasons, because the supplier has discontinued a material, or because the supplier has moved production facilities.

Initial setup of the bonding process

The process for the new product is not stable, and the critical start of production is just around the corner.

Solution of an urgent process issue

Key personnel with the necessary experience are no longer available and problems in the process are piling up.

Readjustment of the bonding process

Although nothing has changed, the process is no longer stable and the ability to deliver to the customer is under threat.

Optimization of the bonding tool

A change to a new bonding tool with optimized geometries must be made in response to process problems or design changes.

Validation of a new supplier

Due to supply chain bottlenecks, a new supplier must be checked and approved at short notice using structured bond tests.

Improve your wire bonding results

Set up your ideal process today

Wire Bonding Service

Process Setup

Our deep focus on wire bonding technology is your advantage. We look at every detail, we know and tell you the hidden traps, we have seen many processes run stable and many more run even better. Let's get even better results for you.

Fast implementation of improvements
Immediate cost savings from fewer errors
Independent of bonding machine types

Examples of customer projects

Bondability test on resonating pads
Plastic overmolded leadframe for 500 μm thick wire bonding
F&S Bondtec 5850 bond head
Determination of shear force and fracture pattern
Duration 2 weeks from delivery of the parts to the short report to the customer
Benchmarking of various PCB suppliers
Printed circuit board with ENIG metallization for 25 μm AlSi1 wedge/wedge wire bonding
F&S Bondtec 5830 bond head (Bond-IQ) and
 Delvotec G5 (at the customer)
Incoming inspection and bondability test according to DVS-2811 plus material analysis
Project coordination and experiments over a period of approx. 4 months
Comparison of different types of bonding wire
Thick wire bonding with 300 μm diameter on DCB surfaces
F&S Bondtec 5850 bond head incl. deformation monitoring and data acquisition
Bondability test in accordance with DVS-2811 using response surface DOE and fully automated data acquisition
6 weeks for data acquisition and analysis, plus 3 weeks for an application report and conference presentation
Optimization of extremely steep loop geometries
Extreme height step of several millimeters with short spacing
25 μm Wedge/Wedge AlSi1 wire bonding and video studies of the loop formation
Optimization of the loop parameters with regard to low heel damage, testing using pull test
3 weeks for data acquisition, analysis and report
Evaluation of the bond quality of automotive products
Delivery of random assemblies taken from production, bonded with 25 μm AlSi1 using the wedge/wedge process
Inspection, pull tests, SEM analyses
Weak point analysis and risk assessment
5 weeks for data acquisition, analysis and report, weekly short reporting via MS teams incl. live presentation and discussion of particularly critical defects
Your fastest way to work with us
Request by e-mail
Initial telephone consultation
Provision of further data by the customer for a first indicative offer
Preparation of an official offer
Fine-tuning the offer and specifying the next steps

Get in contact for service & support

Get in contact for service & support

Frequently Asked Questions

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Why is fine-tuning the process important?

Fine-tuning the process is crucial because it ensures higher yield, reliability, and longevity of your products. Poorly optimized wire bonding can lead to performance issues, reduced product lifespan, and higher production costs.

What kind of support do you offer for wire bonding process optimization?

We provide comprehensive support, including process assessment, parameter optimization, material selection guidance, and production environment assessment. Our team works closely with you to understand your specific needs and challenges, providing tailored solutions that improve bonding quality, reduce defects, and enhance overall productivity.

How do you assess the current state of my wire bonding process?

Our experts conduct a detailed evaluation of your existing process, which includes examining materials, equipment, and bonding parameters. We may analyze visual inspection capabilities, wire pull tests, bond shear strength, and other key performance indicators to identify areas for improvement.

What are some common issues that arise in wire bonding processes?

Some common issues include weak bond strength, wire breakage, non-uniform bond shapes, pad damage, and contamination. These can stem from improper settings, incorrect material choices, supplier issues or inadequate equipment. Our support helps diagnose and resolve these issues efficiently.

Do you offer on-site support and training for wire bonding processes?

Yes, we provide on-site support and training. Our specialists can visit your facility to offer hands-on training to your staff, helping them understand the equipment, optimize settings, and troubleshoot common issues. We also offer remote support if required.

How do you ensure quality control in the wire bonding process?

We focus on both process and product quality. By helping you establish rigorous process controls, monitor key performance metrics, and implement regular testing (such as visual inspection, wire pull and bond shear tests), we ensure that your wire bonding process meets industry standards and minimizes defects.

What types of wire bonding do you specialize in?

We support all major wire bonding techniques, including gold ball bonding, aluminum wedge bonding, and copper wire bonding. Each method requires specific tuning and expertise, and we provide guidance tailored to the method you're using.

How quickly can we expect improvements after working with your team?

The timeline for improvements varies depending on the complexity of your process and the extent of optimization needed. However, most customers begin seeing improvements in process efficiency, bond quality, and yield starting from the day we begin our collaboration and when they start implementing our recommendations.

What are the costs associated with wire bonding process support?

The costs depend on the level of support required, the complexity of the process, and whether on-site visits or equipment recommendations are needed. We provide a detailed cost breakdown after an initial assessment, ensuring transparency and value for your investment.

How can we get started with your wire bonding process optimization service?

To get started, simply contact our team to schedule an initial consultation. We'll review your current process, discuss your goals, and create a customized action plan to optimize your wire bonding process for improved performance and efficiency. This initial contact is free of charge and often includes some useful tips for immediate implementation and problem solving.

Independent in the market and internationally networked
800
+
Enthusiastic customers and participants
65
Years of wire bonding knowledge
23
Years of experience