Wire bond testing, feasibility studies and prototype assembly
Wire bonding processes with thin or thick wire from 17.5 μm to 500 μm wire diameter are possible on fully automatic wire bonding machines and available for customer projects. We are specialized in short lead times for small lot sizes. We schedule projects within a maximum of 8 weeks to ensure that new customer orders are processed quickly.
![](https://cdn.prod.website-files.com/6682645c4821bac35664a429/67053253e05247ac906d6a9f_bond_iq_seminar-07392.avif)
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Prototype assembly and comprehensive wire bonding testing
At Bond-IQ, we specialize in wire bond testing, feasibility studies, and prototype assembly to meet the unique needs of your project. Utilizing fully automated wire bonding machines, we handle both thin and thick wire bonding processes with wire diameters ranging from 17.5 μm to 500 μm. Our focus on short lead times for small lot sizes ensures that new customer orders are processed promptly - typically scheduling projects within a maximum of 8 weeks.
Equipped with an extensive portfolio of wire bonding technologies and advanced analytical equipment, we provide fast and effective solutions to your challenges. Whether you need electrically functional assemblies or want to test the feasibility of a new application, our team of experts can help you achieve your goals efficiently and effectively.
Our technical capabilities
Discover the advanced tools and machinery that drive our innovation and precision.
![](https://cdn.prod.website-files.com/6682645c4821bac35664a429/671a13e8f01a8e9f7164be09_8aa078bd6a30138d2c89b9ee9e58858d_F%26S%20Bondtec%2058xx.avif)
Bonding area 6 inch x 8 inch (15 cm x 20 cm)
Manual and fully automatic bonding
Convertible to multiple bond heads for ball/wedge, wedge/wedge and thick wire bonding processes
![](https://cdn.prod.website-files.com/6682645c4821bac35664a429/671a14f135755004568e5abd_94796f0945d5e1b254a9e8bb1fdf2d3c_F%26S%20Bondtec%2056xx.avif)
Bond area 4 inch x 4 inch (10 cm x 10 cm)
Manual and fully automatic bonding/testing
Convertible to multiple bond heads for ball/wedge, wedge/wedge and thick wire bonding processes
Can be converted to manual and fully automatic pull and shear tests
BAMFIT-capable (Gen.2)
![](https://cdn.prod.website-files.com/6682645c4821bac35664a429/671a13e8ed5c241a98a10bb7_2a38acb957aa0dee2cba315c48cc03ca_BAMFIT%20Tester%20GEN.1.avif)
Test area 4 inch x 4 inch (10 cm x 10 cm)
Manual and fully automatic testing
BAMFIT test on thick wires from 125 μm to 500 μm made of aluminum and up to a maximum of 300 μm made of copper
![](https://cdn.prod.website-files.com/6682645c4821bac35664a429/671a13e96b761369e6d9049e_02bb1e304355f3cc2c2487101573a9e3_Bond%20Pull%20Tester%20LAB-Tester.avif)
Test area 3 inch x 3 inch (7.5 cm x 7.5 cm)
Manual pull tests on thin wires for forces up to 100 cN
![](https://cdn.prod.website-files.com/6682645c4821bac35664a429/671a13e8f01a8e9f7164be09_8aa078bd6a30138d2c89b9ee9e58858d_F%26S%20Bondtec%2058xx.avif)
Bonding area 6 inch x 8 inch (15 cm x 20 cm)
Fully automatic bonding and parallel acquisition of process data and environmental parameters
Simulation of in-situ monitored wire bond production
![](https://cdn.prod.website-files.com/6682645c4821bac35664a429/6787c494b5788f0fdf83e418_Filtro-azulprox.avif)
Phenom desktop SEM for short-term analysis of wire bonds and surfaces
Magnification typically up to a maximum of 5,000x
![](https://cdn.prod.website-files.com/6682645c4821bac35664a429/6787c5518996ee3a71fb9087_olympus-lext.avif)
Olympus LEXT confocal microscope for quality and topography measurements
![](https://cdn.prod.website-files.com/6682645c4821bac35664a429/6787c5d3c1b3d41c5e33818b_zeiss-axio-vision.avif)
Indispensable standard tool in wire bonding for all applications and wire diameters
Viewing area at full magnification and resolution approx. 125 μm x 125 μm
![](https://cdn.prod.website-files.com/6682645c4821bac35664a429/6787c6c5f162ca1093b1fb5a_leica-stereo-m.avif)
Tool for documentation (incoming and outgoing inspection) and quick visual inspection of prototypes after bonding
5830 (140 kHz) and 5630 (100 kHz) bond head for 17.5 μm to 75 μm wire diameter
Aluminum, gold and copper wire
Special materials on request
5810 (140 kHz) and 5610 (58 kHz) bond head for 17.5 μm to 50 μm wire diameter
Gold and copper wire
5850 (58 kHz and 85 kHz) bond head for 125 μm to 500 μm wire diameter
Aluminum, CuCorAl and copper wire (max. 300 μm)
Special materials on request
Shear chisel widths from 80 μm to 360 μm for shear forces up to 500 cN
For ball shear tests, thick wires up to 200 μm diameter and sample preparation (e.g. shear tests on AlSi1 wedge bonds)
High-resolution light microscopy to assess the fracture patterns
Shear chisel widths up to 1.2 mm for shear forces up to 5000 cN
For thick wires from 250 μm diameter and small chips up to a maximum edge length of 1 mm x 1 mm
High-resolution light microscopy to assess the fracture patterns
Pull forces from 100 cN to 5000 cN
For thin and thick wires from 17.5 μm to 500 μm diameter
High-resolution light microscopy to assess the fracture patterns
FDM printer for processing PLA
In use for component holders (without heating), transport/storage boxes, bonder accessories, assembly aids
FDM printer for processing PLA, ASA, PETG and special materials (ESD and CF)
Used for demonstration and working models (mockups), large-format fixtures
Multi-color printing for hands-on samples in bond seminars and training sessions
FDM printer for processing PLA, ABS and TPU
Suitable for two-material printing
Used for transport/storage boxes, assembly aids, demonstration and working models (mockups)
Processing of foils, wood, packaging materials, foam
Labeling of housing panels
Resin LCD printer for liquid resins
Used for detailed demonstration and working models, detailed hands-on samples in bond seminars and training courses
Ensuring a straight forward and simple ESD protection
Workflow for components with unknown SD sensitivity, protection against component defects
In-house developed software solution for extraction and visualization of BAMFIT measurement data (current curves, frequencies)
Use in crack propagation and lifetime analysis of thick wire bonds
In-house developed software solution for analyzing deformation data from the wire bond system, expandable to frequency, current and phase curves
Used in all wire bond studies to investigate the influence of external factors on bond quality
System for analyzing motion sequences in the wire bonding process using high speed video equipment
In use for the optimization of loop parameters and kinking behavior of wires during the traverse movements of the wire bonder
Facilitates the determination of angle correction factors in the pull test
Let us build your application today
Application Test
Equipped with an extensive portfolio of wire bonding technologies and supporting equipment for analysis and prototyping, we can quickly provide you with solutions to your problems. Whether you just need electrically functional assemblies or want to test the feasibility of an application, with our support you can implement this quickly and purposefully.
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Some of our wire bonding projects
Insights from our customers
Each project represents a unique partnership, and we take pride in the impactful results we achieve together. Below, you’ll find testimonials and case studies from clients who have entrusted us with their goals—whether to drive growth, enhance efficiency, or unlock new potential. Their success stories inspire us to continue delivering exceptional value and building lasting relationships.
Design and process adaptation led to a reduction in process time from 45 min to less than 10 min with a simultaneous reduction in material costs."
— Large German mechanical engineering company
"Development of a comprehensive supplier specification for our printed circuit boards - first version already after 24 h, review and release at our company after only 5 days."
— German automotive supplier
"Inquiry, callback and problem solving within one afternoon. All by phone and within only 30 min despite a tricky challenge."
— Medium-sized contract manufacturer
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Get in contact for service & support
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Get in contact for service & support
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Frequently Asked Questions
We handle both thin and thick wire bonding processes, accommodating wire diameters from 17.5 μm to 500 μm. Our fully automated wire bonding machines support various bonding techniques and materials, enabling us to meet a wide range of project requirements for testing, feasibility studies, and prototypes.
We prioritize quick turnarounds and aim to schedule projects within a maximum of 8 weeks. For many projects, such as feasibility studies or small prototype batches, we can complete work within 2-10 days, depending on the complexity and number of parts required. This flexibility allows us to meet urgent deadlines and small-lot requirements.
Our feasibility studies test new or unknown surfaces, wire materials, bonding tools, geometries, and loop shapes. We conduct a focused series of experiments with thorough documentation, providing a cost-effective initial assessment of your project’s feasibility. Most feasibility studies take between 0.5 and 2 days, offering a quick yet detailed evaluation.
Yes, we wire bond small prototype production batches. After agreeing on all assembly details through email or web conference, we can deliver 10-100 parts within 2-10 days. For larger orders (100+ parts), the timeline depends on workload and project complexity.
We offer comprehensive bond testing, including bond parameter variation followed by visual inspection and pull/shear testing according to DVS-2811 or other applicable standards. We can perform bond tests on new surfaces using customer-supplied samples, ensuring statistical robustness with sufficient test space.
We provide detailed reports with all testing results, including visual inspections, pull/shear test data, and analysis outcomes. For customers who prefer a summary, we can offer a condensed application report, which is useful for documenting the bonding material’s performance or for marketing purposes.
Yes, we encourage customer collaboration. You’re welcome to work with our team on-site to build prototypes, inspect samples, and get an understanding of any anomalies.
We are equipped with a comprehensive portfolio of advanced wire bonding machines from F&S Bondtec and analytical tools to support testing, prototyping, and feasibility studies. Our fully automated machines are capable of precise wire bonding with both thin and thick wires, and we also use manual bonding techniques for small sample setups.
Our testing procedures align with DVS-2811 standards for pull and shear tests, ensuring high-quality and consistent bond strength evaluations. If your project requires other specific standards, please let us know, and we’ll accommodate them where possible (e.g. MIL-883, ASTM F459, ASTM F458, JEDEC JESD22-B116B, AEC Q100-001C, AEC Q101-003A).
We prefer short lead times for small-lot projects. Our efficient scheduling, combined with our in-house technology and expertise, allows us to complete projects within 2-6 weeks, depending on the project scope. For urgent orders, we’ll work with you to set up timelines that meet your needs.
Yes, we typically require customers to provide the materials and components needed for the project. This ensures that the prototypes and testing closely represent your final product. However, we can work with suitable dummy samples initially to help set up the wire bonding process if your components are not yet available. Furthermore our extensive network of users and suppliers allows us to get materials and equipment quickly if needed.
Prototype assembly includes setting up the wire bond applications on dummy samples, creating bond programs, testing the bonding process, assembling the samples, and performing final inspection. We then package the assembled prototypes and provide a report with wire bond parameters and bond programs if requested.
Yes, when only a few connections are needed, we offer manual wire bonding as a cost-effective solution. For larger batches or complex assemblies, we create a complete wire bonding program to automate the process and ensure precision and repeatability.
We require sufficient sample sizes and test areas to achieve statistically robust results. Our bond tests are carefully structured, with parameter variations, visual inspections, and mechanical pull/shear testing, allowing for reliable data and repeatable results that meet industry standards.
Getting started is simple. Contact our team to discuss your project goals and requirements. We’ll work with you to determine the appropriate testing, feasibility study, or prototype assembly approach, schedule your project, and coordinate the details to ensure a smooth and efficient process.
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