Wire bond testing, feasibility studies and prototype assembly

Wire bonding processes with thin or thick wire from 17.5 μm to 500 μm wire diameter are possible on fully automatic wire bonding machines and available for customer projects. We are specialized in short lead times for small lot sizes. We schedule projects within a maximum of 8 weeks to ensure that new customer orders are processed quickly.

Prototype assembly and comprehensive wire bonding testing

Expert solutions for challenges in wire bonding

At Bond-IQ, we specialize in wire bond testing, feasibility studies, and prototype assembly to meet the unique needs of your project. Utilizing fully automated wire bonding machines, we handle both thin and thick wire bonding processes with wire diameters ranging from 17.5 μm to 500 μm. Our focus on short lead times for small lot sizes ensures that new customer orders are processed promptly - typically scheduling projects within a maximum of 8 weeks.

Equipped with an extensive portfolio of wire bonding technologies and advanced analytical equipment, we provide fast and effective solutions to your challenges. Whether you need electrically functional assemblies or want to test the feasibility of a new application, our team of experts can help you achieve your goals efficiently and effectively.

Our technical capabilities

Discover the advanced tools and machinery that drive our innovation and precision.

Fully automatic wire bond machine
F&S Bondtec 58xx
  • Bonding area 6 inch x 8 inch (15 cm x 20 cm)

  • Manual and fully automatic bonding

  • Convertible to multiple bond heads for ball/wedge, wedge/wedge and thick wire bonding processes

Fully automatic wire bond machine
F&S Bondtec 56xx
  • Bond area 4 inch x 4 inch (10 cm x 10 cm)

  • Manual and fully automatic bonding/testing

  • Convertible to multiple bond heads for ball/wedge, wedge/wedge and thick wire bonding processes

  • Can be converted to manual and fully automatic pull and shear tests

  • BAMFIT-capable (Gen.2)

Testing device
BAMFIT Tester GEN.1
  • Test area 4 inch x 4 inch (10 cm x 10 cm)

  • Manual and fully automatic testing

  • BAMFIT test on thick wires from 125 μm to 500 μm made of aluminum and up to a maximum of 300 μm made of copper

Testing device
Bond Pull Tester LAB-Tester
  • Test area 3 inch x 3 inch (7.5 cm x 7.5 cm)

  • Manual pull tests on thin wires for forces up to 100 cN

Testing device
F&S Bondtec 58xx + TraceX
  • Bonding area 6 inch x 8 inch (15 cm x 20 cm)

  • Fully automatic bonding and parallel acquisition of process data and environmental parameters

  • Simulation of in-situ monitored wire bond production

Analysis equipment
SEM-Analytics (Cooperation)
  • Phenom desktop SEM for short-term analysis of wire bonds and surfaces

  • Magnification typically up to a maximum of 5,000x

Analysis equipment
3D measurement (Cooperation)
  • Olympus LEXT confocal microscope for quality and topography measurements

Analysis equipment
Light microscope up to 1000x magnification
  • Indispensable standard tool in wire bonding for all applications and wire diameters

  • Viewing area at full magnification and resolution approx. 125 μm x 125 μm

Analysis equipment
Stereo microscope
  • Tool for documentation (incoming and outgoing inspection) and quick visual inspection of prototypes after bonding

Wire bond head
Wedge/Wedge thin wire
  • 5830 (140 kHz) and 5630 (100 kHz) bond head for 17.5 μm to 75 μm wire diameter

  • Aluminum, gold and copper wire

  • Special materials on request

Wire bond head
Ball/Wedge Thin Wire
  • 5810 (140 kHz) and 5610 (58 kHz) bond head for 17.5 μm to 50 μm wire diameter

  • Gold and copper wire

Wire bond head
Wedge/ Wedge thick wire
  • 5850 (58 kHz and 85 kHz) bond head for 125 μm to 500 μm wire diameter

  • Aluminum, CuCorAl and copper wire (max. 300 μm)

  • Special materials on request

Mechanical test
Ball shear test
  • Shear chisel widths from 80 μm to 360 μm for shear forces up to 500 cN

  • For ball shear tests, thick wires up to 200 μm diameter and sample preparation (e.g. shear tests on AlSi1 wedge bonds)

  • High-resolution light microscopy to assess the fracture patterns

Mechanical test
Shear test thick wire
  • Shear chisel widths up to 1.2 mm for shear forces up to 5000 cN

  • For thick wires from 250 μm diameter and small chips up to a maximum edge length of 1 mm x 1 mm

  • High-resolution light microscopy to assess the fracture patterns

Mechanical test
Pulltest thin/thick wire
  • Pull forces from 100 cN to 5000 cN

  • For thin and thick wires from 17.5 μm to 500 μm diameter

  • High-resolution light microscopy to assess the fracture patterns

Prototyping tools
Prusa MK3S 3D-printer
  • FDM printer for processing PLA

  • In use for component holders (without heating), transport/storage boxes, bonder accessories, assembly aids

Prototyping tools
Bambulab 3D-printer
  • FDM printer for processing PLA, ASA, PETG and special materials (ESD and CF)

  • Used for demonstration and working models (mockups), large-format fixtures

  • Multi-color printing for hands-on samples in bond seminars and training sessions

Prototyping tools
Ultimaker 3D-printer
  • FDM printer for processing PLA, ABS and TPU

  • Suitable for two-material printing

  • Used for transport/storage boxes, assembly aids, demonstration and working models (mockups)

Prototyping tools
Lasercutter 5W
  • Processing of foils, wood, packaging materials, foam

  • Labeling of housing panels

Prototyping tools
Elegoo Mars 3D-printer
  • Resin LCD printer for liquid resins

  • Used for detailed demonstration and working models, detailed hands-on samples in bond seminars and training courses

Prototyping tools
ESD Basic equipment
  • Ensuring a straight forward and simple ESD protection

  • Workflow for components with unknown SD sensitivity, protection against component defects

Software tools
BAMFIT data analysis
  • In-house developed software solution for extraction and visualization of BAMFIT measurement data (current curves, frequencies)

  • Use in crack propagation and lifetime analysis of thick wire bonds

Software tools
Process data analysis
  • In-house developed software solution for analyzing deformation data from the wire bond system, expandable to frequency, current and phase curves

  • Used in all wire bond studies to investigate the influence of external factors on bond quality

Software tools
Process video analysis
  • System for analyzing motion sequences in the wire bonding process using high speed video equipment

  • In use for the optimization of loop parameters and kinking behavior of wires during the traverse movements of the wire bonder

  • Facilitates the determination of angle correction factors in the pull test

Get things done

Let us build your application today

Wire Bonding Service

Application Test

Equipped with an extensive portfolio of wire bonding technologies and supporting equipment for analysis and prototyping, we can quickly provide you with solutions to your problems. Whether you just need electrically functional assemblies or want to test the feasibility of an application, with our support you can implement this quickly and purposefully.

Start quickly, finish early
Pragmatic with an eye for detail
Open-minded and flexible

Some of our wire bonding projects

Bond tests on new surfaces
Supply of samples by customer or partners with sufficient space for statistically robust bond tests
Bond parameter variation followed by visual inspection and pull/shear tests according to DVS-2811 or other test standards
Comprehensive report with all results – also available in a condensed form as an application report e.g. for the marketing of bonding materials
Typical duration: 2-6 weeks
Joint work with the customer on the bonding machine to build prototypes
The materials and components are brought along by the customer.
Customer consulting/training by joint inspection of samples, documentation of anomalies, selection of wire bonding method, preparation of component fixation
Manual wire bonding is used when only a few connections need to be made. Alternatively, a complete wire bonding program is created.
Setting up the samples and handing them over to the customer. Handover of wire bond parameters and bond programs if requested.
Typical runtime: 0.5-2 days
Assembly of small prototype production batches
Agreement on all details of the assemblies to be realized by e-mail and web conference
Preparation of wire bond application on suitable dummy samples to effectively utilize the time until sample delivery and to save valuable prototypes during process setup
Creation of a bond program, detailed examination of the wire bonding process, assembly of the samples
Final inspection, documentation, packaging
Typical delivery time: 2-10 days for 10-100 parts, 100+ parts depending on the workload and complexity
Application test / feasibility study
Testing of new/unknown surfaces, wire materials, tools, geometric arrangements, designs and loop shapes
Small, focused series of experiments with concise documentation for a cost-effective initial assessment of the feasibility of a project/idea
Typical duration: 0.5 - 2 days

Insights from our customers

Each project represents a unique partnership, and we take pride in the impactful results we achieve together. Below, you’ll find testimonials and case studies from clients who have entrusted us with their goals—whether to drive growth, enhance efficiency, or unlock new potential. Their success stories inspire us to continue delivering exceptional value and building lasting relationships.

Design and process adaptation led to a reduction in process time from 45 min to less than 10 min with a simultaneous reduction in material costs."

— Large German mechanical engineering company

"Development of a comprehensive supplier specification for our printed circuit boards - first version already after 24 h, review and release at our company after only 5 days."

— German automotive supplier

"Inquiry, callback and problem solving within one afternoon. All by phone and within only 30 min despite a tricky challenge."

—  Medium-sized contract manufacturer

Your fastest way to work with us
Request by e-mail
Initial telephone consultation
Provision of further data by the customer for a first indicative offer
Preparation of an official offer
Fine-tuning the offer and specifying the next steps

Get in contact for service & support

Get in contact for service & support

Frequently Asked Questions

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What types of wire bonding methods can you handle for testing and prototypes?

We handle both thin and thick wire bonding processes, accommodating wire diameters from 17.5 μm to 500 μm. Our fully automated wire bonding machines support various bonding techniques and materials, enabling us to meet a wide range of project requirements for testing, feasibility studies, and prototypes.

How quickly can you schedule a project, and what are the lead times?

We prioritize quick turnarounds and aim to schedule projects within a maximum of 8 weeks. For many projects, such as feasibility studies or small prototype batches, we can complete work within 2-10 days, depending on the complexity and number of parts required. This flexibility allows us to meet urgent deadlines and small-lot requirements.

What is involved in a wire bond feasibility study, and how long does it take?

Our feasibility studies test new or unknown surfaces, wire materials, bonding tools, geometries, and loop shapes. We conduct a focused series of experiments with thorough documentation, providing a cost-effective initial assessment of your project’s feasibility. Most feasibility studies take between 0.5 and 2 days, offering a quick yet detailed evaluation.

Can you provide prototype assemblies, and what is the typical timeline?

Yes, we wire bond small prototype production batches. After agreeing on all assembly details through email or web conference, we can deliver 10-100 parts within 2-10 days. For larger orders (100+ parts), the timeline depends on workload and project complexity.

What wire bond testing services do you offer?

We offer comprehensive bond testing, including bond parameter variation followed by visual inspection and pull/shear testing according to DVS-2811 or other applicable standards. We can perform bond tests on new surfaces using customer-supplied samples, ensuring statistical robustness with sufficient test space.

What kind of reporting do you provide with your testing and feasibility studies?

We provide detailed reports with all testing results, including visual inspections, pull/shear test data, and analysis outcomes. For customers who prefer a summary, we can offer a condensed application report, which is useful for documenting the bonding material’s performance or for marketing purposes.

Can I be involved in the prototype building and testing process?

Yes, we encourage customer collaboration. You’re welcome to work with our team on-site to build prototypes, inspect samples, and get an understanding of any anomalies.

What equipment and technology do you use for testing and prototyping?

We are equipped with a comprehensive portfolio of advanced wire bonding machines from F&S Bondtec and analytical tools to support testing, prototyping, and feasibility studies. Our fully automated machines are capable of precise wire bonding with both thin and thick wires, and we also use manual bonding techniques for small sample setups.

What wire bonding standards do you follow for bond testing?

Our testing procedures align with DVS-2811 standards for pull and shear tests, ensuring high-quality and consistent bond strength evaluations. If your project requires other specific standards, please let us know, and we’ll accommodate them where possible (e.g. MIL-883, ASTM F459, ASTM F458, JEDEC JESD22-B116B, AEC Q100-001C, AEC Q101-003A).

How do you handle small-lot orders and short lead times?

We prefer short lead times for small-lot projects. Our efficient scheduling, combined with our in-house technology and expertise, allows us to complete projects within 2-6 weeks, depending on the project scope. For urgent orders, we’ll work with you to set up timelines that meet your needs.

Do I need to supply materials and components for testing or prototype assembly?

Yes, we typically require customers to provide the materials and components needed for the project. This ensures that the prototypes and testing closely represent your final product. However, we can work with suitable dummy samples initially to help set up the wire bonding process if your components are not yet available. Furthermore our extensive network of users and suppliers allows us to get materials and equipment quickly if needed.

What is included in the prototype assembly process?

Prototype assembly includes setting up the wire bond applications on dummy samples, creating bond programs, testing the bonding process, assembling the samples, and performing final inspection. We then package the assembled prototypes and provide a report with wire bond parameters and bond programs if requested.

Do you offer manual wire bonding for small prototypes?

Yes, when only a few connections are needed, we offer manual wire bonding as a cost-effective solution. For larger batches or complex assemblies, we create a complete wire bonding program to automate the process and ensure precision and repeatability.

How do you ensure statistical robustness in bond tests?

We require sufficient sample sizes and test areas to achieve statistically robust results. Our bond tests are carefully structured, with parameter variations, visual inspections, and mechanical pull/shear testing, allowing for reliable data and repeatable results that meet industry standards.

How can I get started with wire bond testing or a prototype project?

Getting started is simple. Contact our team to discuss your project goals and requirements. We’ll work with you to determine the appropriate testing, feasibility study, or prototype assembly approach, schedule your project, and coordinate the details to ensure a smooth and efficient process.

Independent in the market and internationally networked
800
+
Enthusiastic customers and participants
65
Years of wire bonding knowledge
23
Years of experience