Efficiently perform failure analysis. Identify root causes faster.

You can rely on our expertise in wire bonding and the interpretation of analysis results. Our focus on this technology is your advantage. When it comes to wire bond connections, you can count on us for specific statements and interpretations.

Transforming Analysis into actionable Insights

Expert interpretations to speed up your solution finding

When an error occurs, it is usually important that the first analysis results are available quickly. However, the interpretation of the results and their implications for further analysis and process settings is much more important.

You can rely on us to know exactly how wire bonding works and how to interpret the analysis results. Our deep focus on this technology is your advantage. When it comes to wire bonding, you get specific statements and interpretations from us.

It is helpful to receive an analysis report from a laboratory that summarizes the results. But it is even better to get direct recommendations for your process or product from technology experts, which will help you reach your goal faster and more reliably.

Analysis expertise when needed

Methods generally used for failure analysis

Light microscopy
REM/EDX analyses
FIB preparations
Pull and shear tests
Cross sections
TOF-SIMS analyses

Typical situations in which our customers request support

Customer complaint

A customer took a closer look at an assembly and discovered wire bond anomalies that were previously unknown in appearance and cause.

Downtime in production

Production is currently at a standstill. The wire bonds are not sticking, and even those assemblies that have been successfully bonded are causing considerable uncertainty among those responsible.

Failures during product qualification

The bond strength is good and passes all internal quality tests according to applicable standards. However, the products do not survive the environmental simulations during qualification.

Poor bond quality of a delivered PCB batch

The bonding process has been good and stable for a long time. The deviating bonding results of the currently delivered PCB batch are not explainable.

Unexpected error pattern during pull/shear test

Recently, the production department has been reporting unusual abnormalities during the mechanical test more often. The measured forces are fine, but the team is still feeling insecure.

Regular audit of your wire bond quality

Experienced quality inspectors follow the motto ‘four eyes see more than two’. Get a second opinion on your current product quality on a regular basis by sending us randomly selected samples at fixed time intervals for quality inspection.

Field failure at the end customer's premises

A car suddenly stops with error messages, monitoring systems in industrial plants fail or a device no longer works immediately after installation. The components can be replaced quickly, but it is essential to clarify how great the potential for danger is – the cause must be found.

Get quick feedback and solutions when times are tough

Request a remote consultation today

Wire Bonding Service

Failure Analysis

With more than 20 years of experience in failure analysis of wire-bonded assemblies, we have seen many causes of field failures, some of them complex. You benefit from our ability to quickly narrow down the causes and avoid unnecessary activities.

Efficient Error Analysis Implementation
Expertise in Wire Bonding and Analysis
Clear statements, valuable insights

Examples from failure analyses in customer projects

Sensor failure in a car
Initial evaluation at the light microscope
FIB (Focused Ion Beam) analysis in a defect region as verification of the failure thesis
Several meetings with the customer, including the selection of suitable retained samples for further analyses
TOF-SIMS (mass spectrometry and time-of-flight) analysis to determine sources of corrosive substances, interpretation of the analysis reports for the customer
Support over a period of several months through flexible analysis and consulting budgets
Failure of production batches after temperature storage
Fast start and execution with an already existing consulting and analytics contingent
Discussion and evaluation of the available data and the situation at the customer's premises in a web conference
Formulation of a failure hypothesis and creation of an experimental matrix for targeted process optimization at the customer's premises
Advanced interface analysis using etching methods, light microscopy and image processing algorithms for an even more precise evaluation of the improved bond quality after optimization, comparison with retained samples of the failed component batches
Proof of the effectiveness of the measures via renewed temperature exposure --> passed!
Bonding problems and non-sticks on first prototypes
Initial contact by telephone and web conference to review the results available and tests already carried out - finding: customer's data situation unclear
Arrangement of a date for joint bonding tests in a suitable environment and systematic execution of experiments
Clear result after just 1 hour: contamination
Testing of various cleaning methods and bonding parameter sets
Follow-up support for the customer at regular intervals of 1-3 months
Production downtime! Components can no longer be manufactured.
Direct shipment of samples by the customer and short-term processing within a few hours of arrival. Initial assessment with a clear result of the error analysis (contamination) on the same day.
Discussion of corrective actions with the customer, agreement on a plan for short-term cleaning trials and analysis
Implementation of cleaning trials: report of success and provision of results to the customer after just 24 hours
Sending of the affected production batches by the customer for cleaning and return. Processing via a consulting and analytical budget.
Electrical malfunction of semiconductors detected after wire bonding
Contact from the end customer, as components provided by a supplier occasionally show electrical failures.
Inspection of the end customer's data provided by the supplier. Assessment of the data quality and technical consulting for the end customer.
Moderation of a discussion between the end customer and supplier to determine necessary steps and communication of obvious failures to the supplier.
Monitoring of the optimisation steps through parallel quality assessment on individual prototypes of further production batches.

Insights from our customers

Each project represents a unique partnership, and we take pride in the impactful results we achieve together. Below, you’ll find testimonials and case studies from clients who have entrusted us with their goals—whether to drive growth, enhance efficiency, or unlock new potential. Their success stories inspire us to continue delivering exceptional value and building lasting relationships.

Design and process adaptation led to a reduction in process time from 45 min to less than 10 min with a simultaneous reduction in material costs."

— Large German mechanical engineering company

"Development of a comprehensive supplier specification for our printed circuit boards - first version already after 24 h, review and release at our company after only 5 days."

— German automotive supplier

"Inquiry, callback and problem solving within one afternoon. All by phone and within only 30 min despite a tricky challenge."

—  Medium-sized contract manufacturer

Your fastest way to work with us
Request by e-mail
Initial telephone consultation
Provision of further data by the customer for a first indicative offer
Preparation of an official offer
Fine-tuning the offer and specifying the next steps

Get in contact for service & support

Get in contact for service & support

Frequently Asked Questions

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What is failure analysis in the context of wire bonding processes?

Failure analysis involves identifying the causes of defects or performance issues in wire bonding processes or wire bonded devices. This includes examining the bonding process, materials, and environmental factors to determine the root cause of failures, whether they occur during manufacturing or in the field.

What kinds of failures can occur in wire bonding processes?

Common wire bonding failures include weak or intermittent bonds, wire breakage, bond lift, bond corrosion, heel cracking, and pad damage. These problems can be caused by improper bonding parameters, material incompatibility, contamination, surface defects, or equipment malfunction. Field failures often result from a combination of process shortcomings, material degradation, environmental stress (such as temperature and humidity), mechanical stress, contamination, or improper handling during assembly or shipping. Our analysis is designed to pinpoint the exact cause and provide a path to resolution.

How do you approach failure analysis for wire bonding processes?

Our failure analysis process begins with a detailed examination of the affected devices and the bonding process. The essential first step is visual inspection of the parts. Scanning electron microscopy (SEM) may follow if necessary. Cross sectioning, FIB (Focused Ion Beam) preparation and material analysis (e.g. TOF-SIMS) are only performed if really necessary and helpful. We review historical data, previous customer complaints, and process parameters to determine the root cause of the failure.

Can you help with failures that occur at the end customer’s premises?

Yes, we often analyze field failures that occur at your customer's site – this is the situation where the pressure is greatest and external support is inevitable. We can help you determine if the problem is due to your wire bonding process, materials used, or external environmental factors, and provide you with a detailed report and recommended solutions.

How quickly can you analyze a failure and provide a report?

The timeline for failure analysis depends on the complexity of the failure and the amount of testing required. For most cases, we can provide preliminary findings within a few days, and a detailed report and root cause analysis within 1-2 weeks. Urgent cases may be prioritized. If the situation is still unknown and no other analysis results are available, you can significantly speed up the process by sending us a small selection of parts for visual inspection as soon as possible.

What types of testing do you conduct during failure analysis?

We use a variety of techniques, including visual inspection by optical microscopy, scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDS), bond pull testing, and shear testing. These help us to thoroughly evaluate bond quality and identify potential failure mechanisms.

Can you assist with improving the reliability of wire bonded devices after failure analysis?

Absolutely. Once we determine the root cause of a failure, we provide recommendations to improve process control, material selection and equipment settings. We also provide guidance on preventive measures to improve the long-term reliability of your wire bonded devices.

Do you provide on-site support for failure analysis and root cause investigation?

Yes, we provide on-site support when needed. Our team can visit your facility or your customer's site to assess the failure firsthand, perform inspections, and work closely with your team to develop solutions. We also offer remote consulting for less complex cases.

How do you ensure confidentiality and data protection during failure analysis?

We take confidentiality and privacy very seriously. All findings, reports and client information are kept secure, and we can sign non-disclosure agreements (NDAs) prior to any analysis to ensure that your intellectual property and sensitive data is protected throughout the analysis process.

How do you handle customer complaints related to wire bonded device failures?

We work with you to thoroughly investigate customer complaints by reviewing the failed equipment, analyzing the bonding process, and evaluating potential root causes. Once the root cause is identified, we provide corrective actions and recommendations to resolve the complaint and prevent recurrence. We can serve as a neutral party to facilitate discussions and provide feedback on your customer's requirements and specifications for corrective actions. We help you avoid unnecessary analysis, documentation and discussion.

What is the cost of failure analysis and root cause investigation services?

Costs vary depending on the complexity of the failure, the type of analysis required, and whether on-site visits are necessary. After an initial consultation, we provide a quote for the first step, which is typically less than €5,000. After completing this first step, we will be better prepared to provide a quote for subsequent analyses and steps. In every quote, we ensure transparency and a clear understanding of the services you'll receive.

How do we start the process of failure analysis or root cause investigation?

To get started, contact our team with details about the failure or problem you're facing. We'll discuss the scope of the analysis, your specific concerns, and any relevant data or samples we'll need. From there, we'll outline a plan for conducting the investigation and delivering actionable results. This initial contact is free of charge and often includes some useful tips for immediate implementation and problem solving.

Independent in the market and internationally networked
800
+
Enthusiastic customers and participants
65
Years of wire bonding knowledge
23
Years of experience