WIRE BONDING PROCESS Support
BENEFIT FROM EXPERT KNOWLEDGE AND QUALIFIED TRAININGS
For tricky problems, customer complaints, unstable bonding processes or the determination of stable bonding parameters, you receive support as required.
PROCESS SETUP & OPTIMIZATION
You have access to more than 20 years of experience with a wide range of bonding equipment in numerous combinations of surfaces and wire materials. Directly in your process at your site or on fully automated equipment in our premises.
In our labs we currently use equipment from F&S Bondtec for:
- Wedge/Wedge wire bonding of 17 to 75 µm wires using 100 and 140 kHz bonding frequency
- Ball/Wedge wire bonding of 17 to 50 µm Drähten using 68 and 140 kHz bonding frequency
- Thick wire bonding of Al, Cu and AlCu-wires at 58 kHz bonding frequency
- Fully automatic pull- and shear testing of thin and thick wires as well a components and mechanical structures
- Interface analysis of thick wire bonds using BAMFIT technology
In addition, we have access to analytical equipment for optical inspection using a light microscope and SEM. For even more complex analyses to determine contaminations and oxides on surfaces, we rely on the expertise of specialised analysis partners with whom we have had good experience several times over to ensure that you receive a reliable analysis result.
Typical situations with clients who call in external support
- Wire bond parameters urgently need to be re-optimised to achieve the given customer specifications for pull and shear tests
- Loop geometries need to be adapted to pass the qualification tests for an existing or new product
- A change of material must be carried out because the change is necessary for functional reasons, the supplier has discontinued a material or has relocated the production site.
- The process for the prototypes of a new product is not running stably and the start of production (SOP) is just around the corner
- Key staff with the necessary experience are no longer available and problems in the process accumulate
- Although nothing has changed, the process no longer runs stably and the ability to deliver is at risk
FAILURE ANALYSIS
As a rule, only a short time may pass before the first analysis results are available. Even more important, however, is the interpretation of what is in front of you and what can be derived from it for follow-up analyses and process settings.
You can rely on the fact that we know exactly how wire bonding works and how to interpret analysis results. Our focus on this field of technology is your advantage. As soon as it comes to wire bonding, you will receive specific statements and interpretations from us.
It is helpful to receive an analysis report that strings together the results. A direct recommendation for action for your process or your product derived from this is even better and helps you to achieve your goal faster and more reliably.
Error analyses for customers usually involve the use of
- Light microscopy
- SEM/EDX analyses
- FIB-preparation
- Pull- and shear tests
- Cross sections
- TOF-SIMS analyses
You fastest way to analyses
- Short first conversation by phone
- You provide pictures or a first sample for an initial assessment of the situation
- You will receive an offer for your analysis after a short telephone consultation
CONSULTING PACKAGES
In short consultations – whenever you need them and questions arise – we work together to further improve your solution approaches and decisions in development processes in order to realise even safer products and processes and to ensure the satisfaction of your customers.
In this way, you support your process and development experts in their daily work, which consists of safely designing bond layouts and creating the basis for stable processes, quickly recognising and eliminating errors and reliably identifying root causes.
In the long run, this results in more effective processes, better trained staff and even more motivated process teams that continuously and sustainably improve your process quality.
You can expect answers on the following topics
- All industrially common wire bonding technologies
- Specific details on bonding equipment from F&S Bondtec, F&K Delvotec, Hesse Mechatronics, K&S
- Supplier specification for bond surfaces
- Root cause and failure analysis
- Literature research
- Equipment selection and set-up of the production environment
- Material selection, design and construction
How soon can we start
Immediately after you have placed the order with us. In urgent cases, we only need a short e-mail confirmation of our offer for the first meeting. Your order will then follow promptly.
